ATHENIS_3D: Automotive Tested High-voltage and Embedded Non-volatile Integrated SoC Platform with 3D Technology

Abstract

The ATHENIS-3D FP7 EU project aims at providing new enabling technologies (analog, digital and power components) for high-voltage and high-temperature applications, tested for power systems of new hybrid/electrical vehicles. Innovation is exploited at process/device level (3D chip stacking, wafer level packaging, trench capacitors and TSV-inductors integrated in the interposer, high-reliable non-volatile Magnetic RAM), circuit-level (inductorless high-voltage DC-DC converter, high-temperature 28nm System-on-Chip platform) and system-level (compact 3D embedded power mechatronic system). Enabling high integration levels of complex systems, operating in harsh environments, in a single packaged 3D device, ATHENIS-3D allows for one order of magnitude area reduction vs. today PCB-based power and control systems. Integration costs will be consequently reduced in key industrial sectors for Europe where high-voltage/temperature operations are mandatory (vehicles, avionics, space/defense, industrial automation, energy). © 2016 EDAA.

Original document

The different versions of the original document can be found in:

• http://dx.doi.org/10.3850/9783981537079_1015

• http://hdl.handle.net/11392/2346884

• http://publica.fraunhofer.de/documents/N-431733.html

• https://iris.unife.it/bitstream/11392/2346884/5/Athenis%20DATE2016_final_postprint.pdf

• https://dblp.uni-trier.de/db/conf/date/date2016.html#WachmannSZTCEGH16,

https://core.ac.uk/display/54715603,

https://dl.acm.org/citation.cfm?id=2972014,

https://arpi.unipi.it/handle/11568/811459,

https://academic.microsoft.com/#/detail/2346287864

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