| Line 3: | Line 3: | ||
This paper presents a comprehensive sequence of analytical methods for evaluating printed circuit board (PCB) pressing processes, augmented by numerical finite element (FE) simulations. The study considers the properties of the prepreg material, the structure of the PCB copper layer, and various pressing process parameters, all of which can be adjusted according to specific requirements. Our results are validated through experiments and compared with the established Squeeze Flow Model. The pro posed methodology identifies potential weaknesses in the design of the copper layer, material selection, and pressing parameters prior to production. Additionally, the implementation of this methodology in an interactive user interface allows for rapid and efficient results, facilitating timely decision-making and process optimization | This paper presents a comprehensive sequence of analytical methods for evaluating printed circuit board (PCB) pressing processes, augmented by numerical finite element (FE) simulations. The study considers the properties of the prepreg material, the structure of the PCB copper layer, and various pressing process parameters, all of which can be adjusted according to specific requirements. Our results are validated through experiments and compared with the established Squeeze Flow Model. The pro posed methodology identifies potential weaknesses in the design of the copper layer, material selection, and pressing parameters prior to production. Additionally, the implementation of this methodology in an interactive user interface allows for rapid and efficient results, facilitating timely decision-making and process optimization | ||
| + | |||
| + | == Full Paper == | ||
| + | <pdf>Media:Draft_Sanchez Pinedo_667791502pap_2580.pdf</pdf> | ||
Revision as of 10:10, 23 October 2024
Abstract
This paper presents a comprehensive sequence of analytical methods for evaluating printed circuit board (PCB) pressing processes, augmented by numerical finite element (FE) simulations. The study considers the properties of the prepreg material, the structure of the PCB copper layer, and various pressing process parameters, all of which can be adjusted according to specific requirements. Our results are validated through experiments and compared with the established Squeeze Flow Model. The pro posed methodology identifies potential weaknesses in the design of the copper layer, material selection, and pressing parameters prior to production. Additionally, the implementation of this methodology in an interactive user interface allows for rapid and efficient results, facilitating timely decision-making and process optimization
Full Paper
Document information
Published on 22/10/24
Submitted on 22/10/24
Volume Advanced Materials: Computational Analysis of Properties and Performance, 2024
DOI: 10.23967/eccomas.2024.010
Licence: CC BY-NC-SA license
Share this document
Keywords
claim authorship
Are you one of the authors of this document?