Latest revision as of 09:36, 5 March 2021

Abstract

This paper presents an innovative cooling solution for active phased array antennas, using a 3D printed liquid cooling device integrated in the structure’s PCB.

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References

[1] “Advanced Concepts for AeroStructures with Integrated Antennas and Sensors”, http://www.acasias-project.eu/

[2] Ebert, T., „Metallkühler für Leistungsbauteile aus dem 3D-Laserdrucker“, Elektronik Praxis: Sonderheft Leistungselektronik (2018), 20 -22.

[3] Wienhausen, A.H., Sewergin, A., de Doncker, R., Highly Integrated Two-Phase SiC Boost Converter with 3D Printed Fluid Coolers and 3D Printed Inductor Bobbins, Proc. PCIM Europe; Int. Exhibition & Conf. Power Electr., Intelligent Motion, Renewable Energy & Energy Mgmt (2018) 1-8.

[4] Curran, B., Reyes, J., Tschoban, C., Höfer, J., Grams, A., Wüst, F., Hutter, M., Leiß, J., Martinez-Vazquez, M., Baggen, R., Ndip, I., Lang, K-D., “Development and Validation of a Chip Integration Concept for Multi-Die GaAs Front-Ends for Phased Arrays up to 60 GHz”, IEEE Trans. Comp., Packaging & Manufacturing Techn. (2018), 8:1231-1240.